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Besides highly reliable standard technology and multilayer boards, Eurotronics offers a broad range of highly integrated (HDI) Printed Circuit Board techniques with blind and buried via's. Our manufacturing capabilities include copper or resin filled micro via's as well as surface finishes that are suitable for wire bonding.

Complex contours and depth milling can be realized with narrow tolerances. Our HDI-substrates can be found mainly in applications where high quality and reliability are of crucial importance. On special request, we can support any type of special material such as Rogers, Arlon... Check out our download area.

Multilayers
Max. Layer Count 30
Max. Finished Thickness 5.0mm
Max. Production Panel Size 609.60mm x 685.80mm
Min. Thickness Core 3mil (76.20μm)
Max. Copper Thickness (depending on the line & space requirements) Inner Layer 6Oz (210μm)
Outer Layer 6Oz (210μm)
Min. Line Width Inner Layer 2.5mil (63.5μm)
Outer Layer 2.7mil (68.50μm)
Min. Line Space Inner Layer 2.5mil (63.5μm)
Outer Layer 3mil (76.20μm)
Impedance Control Tolerance 7%
Min. Drill Size (Mechanical) 0.15mm
Max. Aspect Ratio (Mechanical Drill) 15:1
Min.Laser Drill Size 4mil (101,6μm)
Max. Aspect Ratio (Laser Drill) 1:1
Surface Finishing ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver, Lead Free HASL, HASL, Gold Finger Plating, Selective Hard Gold, Soft Gold, Flash Gold
Advanced Embedded Capacitance 3M:C-PLY14, 19C-PLY14;Faradflex:BC24, BC12TM;Dupont:HK4
High Layer Count + HDI Yes
High Layer Count + HDI + GF Yes
Thermal Management Embedded Copper Coin, Press-fit Copper Coin, Metal Base, Heavy Copper
Hybrid Stack-up Yes (Rogers RO4000 series + FR4)
Material Normal Tg S1141, KB6160A, NP-140
Middle Tg IT158, S1000 H, TU662, NP-155FTL
High Tg IT180A, S1000-2, 370HR, 370Turbo, IS-FR406, NP-175FTL, TU768
Halogen Free IT140G, IT150G, R1566, MCL-BE-67G, S1155
Low Dk/Df RO4350B, RO3003, RO3006, ARLON TC350, N4000-13(SI), N4000-13EP(SI)

Partial Hybrid + Embedded Copper Coin

Press-fit Copper Coin

Stagged Gold Fingers

High Density Interconnect (HDI)
Max. Layer Count 20
Max. Finished Thickness 2.6mm
Min. Finished Thickness 0.3mm
Min. Thickness Core 50μm
Min. Line Width 50.8μm
Min. Line Space 50.8μm
Impedance Control Tolerance 7%
Min. Micro Via Design 50/228μm
Min. Finished Through Via Size 0.1mm
Max. Aspect Ratio Laser Drill Via Hole 0.8:1
Max. Aspect Ratio PTH 10:1
Min. BGA Pitch 0.35mm
Layer To Layer Registration Tolerance +/-50μm
Solder Mask Clearance +/-20μm
Solder Mask Registration 40μm
ELIC Level 14 Layers
Surface Finishing ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver
Advanced Copper Filling Yes
VOP Stack Via Design Yes
Any Layer Yes
Extensive Modular Edge PTH Yes
Carbon Ink Technique Yes
Embedded ESD Yes
Material Middle Tg IT158, EM825, S1000 H, TU662, NP-155FTL,
High Tg IT180A, S1000-2, S1170, EM320
Halogen Free EM825
RCC LG LGF-2000G/LGF-2000GA LG LGF-2000/LGF-2000HF, MITSUI MR500, MATSUSHITA R-0880

Three Step HDI

VOP + FV

ELIC Structure

Backplanes & High Layer Count
Max. Layer Count 48
Max. Finished Thickness 8.0mm
Max. Production Panel Size 609.60mm x 914.40mm
Min. Thickness Core 3mil (76.20μm)
Max. Copper Thickness (depending on the line & space requirements) Inner Layer 6Oz (210μm)
Outer Layer 6Oz (210μm)
Min. Line Width Inner Layer 2.5mil (63.5μm)
Outer Layer 2.7mil (68.50μm)
Min. Line Space Inner Layer 2.5mil (63.5μm)
Outer Layer 3mil (76.20μm)
Impedance Control Tolerance 7%
Min. Drill Size (Mechanical) 0.15mm
Max. Aspect Ratio (Mechanical Drill) 15:1
Min.Laser Drill Size 4mil (101,6μm)
Max. Aspect Ratio (Laser Drill) 1:1
Surface Finishing ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver, Lead Free HASL, HASL, Gold Finger Plating, Selective Hard Gold, Soft Gold, Flash Gold
Middle Tg IT158, S1000 H, TU662, NP-155FTL,
High Tg IT180A, S1000-2, 370HR, 370Turbo, IS-FR406, NP-175FTL, TU768
Halogen Free IT140G, IT150G, R1566, MCL-BE-67G, S1155
Low Dk/Df IS415, N4000-13(SI), N4000-13EP(SI), FR408HR, Megtron4, Megtron6, T150D, IT150DA, IT200LK, RO4350B
Embedded Capacitance 3M:C-PLY14, 19C-PLY14;Faradflex:BC24, BC12TM;Dupont:HK4

Backplane 34 Layers

Flex & Flex-Rigid
Early involvement in the design stage of your flexible circuitry is crucial. Eurotronics supports its customers with the right selection of base materials and production methodes to maximize performance and durability with the most cost effective advantages. On special request we can even provide an assembled end product.
Design: Symmetric/Asymmetric stack-up; 1-F-1; 2-F2; 3-F-3, 0.4mm BGA, ELIC
Max. Layer Count Rigid Flex 14
Max. Layer Count Flex 12
Max. Finished Thickness Rigid part 1.6mm; 2.4mm (Advanced)
Max. Finished Thickness Flex part 1.6mm
Min. Dielectric Thickness 25μm (Standard); 12.5μm (Advanced)
Inner Layer** Line 2mil (50.80μm)
Spacing 2mil (50.80μm)
Outer Layer*** Line 3mil (76.20μm)
Spacing 3mil (76.20μm)
** Applicable on 18μmbase copper without copper plating.
*** Outer layer spacing depends on the actual design, via filling and track width.
Min. Hole Size 2mil (50.8μm) Dielectric 3mil (76.20μm) - Laser Drilled
24mil (609.6μm) Dielectric 6mil (152.4μm) - Mechanical Drilled
63mil (1.6mm) Dielectric 8mil (203.2μm) - Mechanical Drilled
Aspect Ratio (By drilled hole size) 8:1 (Standard); 10:1 (Advanced)
Min. Pad Size Outer Layer 9mil (228.60μm)
Inner Layer 8mil (203.2μm)
Inner Layer Anti-pad 16mil (0.4mm)
Micro Via Technology Blind & Buried Via's Yes
Filled Micro Via's Solder mask, Resin, Copper
POFV Yes
ELIC Level 12 Layers
Back Drilling D+8 (tolerance depends on the design)
Impedance Control Tolerance 10% (5% achievable after process tuning)
Solder Mask Dam 3mil (76.20μm)
Solder Mask Registration 3mil (76.20μm)
Surface Finishing ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver, Lead Free HASL, HASL, Gold Finger Plating, Selective Hard Gold, Soft Gold, Flash Gold
Material Adhesiveless FCCL Dupont Pyralux AC, AP, AK; Doosan, Panasonic
Adhesive FCCL Dupont FP, LF
Coverlay Acrylic: Dupont FR, LF
Adhesive Acrylic: Dupont FR, LF
FR4 (High Tg) TUC TU-862, TU722; EMC EM-370(D), EMC EM825, ITEQ IT180A, Shengyi S1000-2
Pre-Preg TU-72P, TU-86P, EM-37B(D), EM-285B, ITEQ, Shengyi
No/Low Flow Pre-Preg TU-84P, Doosan, ITEQ, Shengyi
Stiffener PI, FR4, Stainless steel, Aluminum, Ceramic
PTFE Arlon AD255A
Shielding Film Tatsuta, Toyo

Double sided Flex + 6Layer Rigid

Arlon AD255A (Immersion Ag)