High Density Interconnect flex circuits offer designers the same benefits of flex circuits—smaller, more reliable products—except at a higher level. In addition to the design benefits of HDIs and micro-via’s listed below, HDI circuits give you more design, layout and construction options helping you finish your design in less time.
Lower cost and smaller size – increased circuit density can eliminate extra layers and save up to 40% compared to non-HDI designs.
Use advanced component packaging – high-I/O and fine-pitch feature capabilities possible with HDI.
More design options and flexibility – blind and buried micro-via’s allow for conductor routing on the internal layers under via’s, creating more usable design space per layer.
Improved electrical performance and signal integrity – micro-via’s in high-speed circuits improve electrical performance by allowing shorter circuit paths, stub reduction and lower cross talk and noise.
Improved thermal performance and reliability – micro-via’s lower the z-axis thermal stresses between adjacent layers.
Improved cost effectiveness – Intelligent panel size maximizes circuit density to increase the efficiency of your assembly process.