Eurotronics and its partner production facility offer rigid PCBs up to 30 layers with a clear focus on miniaturization.
Rigid PCBs are available in many different varieties, going from simple single-sided boards to highly integrated multilayer substrates with blind and buried via’s. An even higher degree of integration can be achieved by using the via-in-pad technology – a combination of copper filled via’s with sequential build-ups and stacked or staggered micro-via’s.
Eurotronics offers a wide variety of special (high-frequency) materials and (ultra) thin high-end FR4 base materials, with anti-CAF and low CTE (Z-axis) of 2.4%, to minimize the CTE mismatch.
Additional functionality can be integrated by using special production methods such as hybrid stack-ups, high precision depth milling or cavity designs, edge metallization etc.
The utilization of these state-of-the-art design features is maximizing the design freedom and is one of the key factors for miniaturization.
In order to achieve a densely integrated substrate with high reliability, most of our HDI designs are being manufactured in PVA-Technology, using copper filled via’s and sequential build-ups.
High frequency PCBs of course come with very specific PTFE based substrates or other. Basically any type of material is available upon request. We regularly work with materials from Rogers, Arlon, Isola I-Tera etc.
